Description
Numbered, two-dimensional marker array for localizing and finding positions on the chip. Enables multilayer exposures, e.g. for the electrical connection of 2D materials deposited on the chip surface.
- Substrate for electron beam lithography (EBL)
- Substrate for ion beam lithography (FIB)
- AFM
Structures:
- Marker spacing: 500 µm in x and y
Chip:
- Size: 10 x 10 x 0.5 mm³
- Substrate material: Silicon or oxidised silicon
- Structure material: 50 nm gold
Offer | Contact

Dr. Uwe Hübner
Head of the Competence Centre for Micro- and Nanotechnologies
Your contact for customised enquiries
Phone: +49 (0) 3641 · 206-126
Email: uwe.huebner@leibniz-ipht.de