Description
Separation of wafers and chips using a wafer saw
- Substrate materials: silicon, quartz, glass
- Diameter up to: 150 mm
- Thickness up to: 5 mm
- Cutting width: 30 µm, 60 µm, 300 µm
Offer | Contact
Andreas Ihring
Your contact for infrared thermal sensors
Phone: +49 (0) 3641 · 206-324
Email: andreas.ihring@leibniz-ipht.de
